Electrically conductive adhesives have recently received a lot of attention by
the researchers as a potential substitute to lead-bearing solders. The two main
classifications of electrical conductive adhesives based on conductive path are isotropically
and anisotropically conductive adhesives. The main application of isotropically conductive
adhesive is in electronic industry. Studies in the field of conductive adhesives have shown
that these matrials have numerous advantages compared to traditional solder technology
in better environmental operation, lower process temperature, more flexibility and simpler
processability. To achieve electrical conductivity, the volume fraction of conductive filler
in an ICA must be equal to or slightly higher than the critical volume fraction that is called
percolation threshold. In this paper discussions are extended to electrical conductivity
mechanism in conductive adhesives, different matrices of conductive adhesives and
conductive fillers, their effects on the electrical conductivity of conductive adhesives, and
developed methods in electrical conductivity processes.
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